Art
J-GLOBAL ID：200902005172780621   Reference number：90A0561827

Thermomechanical properties of IC molding compounds.

ICモールド化合物の熱機械的特性
Author (6)：
BAIR H E

About BAIR H E

(AT&T Bell Lab., New Jersey)

About AT&T Bell Lab., New Jersey

, 
BOYLE D J

About BOYLE D J

(AT&T Bell Lab., New Jersey)

About AT&T Bell Lab., New Jersey

, 
RYAN J T

About RYAN J T

(AT&T Bell Lab., New Jersey)

About AT&T Bell Lab., New Jersey

, 
TAYLOR C R

About TAYLOR C R

(AT&T Bell Lab., New Jersey)

About AT&T Bell Lab., New Jersey

, 
TIGHE S C

About TIGHE S C

(AT&T Bell Lab., New Jersey)

About AT&T Bell Lab., New Jersey

, 
CROUTHAMEL D L

About CROUTHAMEL D L

(AT&T Bell Lab., Pennsylvania)

About AT&T Bell Lab., Pennsylvania


Material：
Polymer Engineering & Science  (Polym Eng Sci)

About Polymer Engineering & Science


Volume： 30  Issue： 10  Page： 609-617  Publication year： May. 1990 
JST Material Number： C0640A  ISSN： 0032-3888  CODEN： PYESA  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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thermomechanical analysis

About thermomechanical analysis

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Other moldings 
(YH04090Q)

About Other moldings

,  Manufacturing technology of solid-state devices 
(NC03030V)

About Manufacturing technology of solid-state devices

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
IC

About IC

, 
モールド

About モールド

, 
熱機械的特性

About 熱機械的特性


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