Art
J-GLOBAL ID：200902012007255616   Reference number：89A0599035

Recent technical trends of thermosetting resins-Material properties and processing techniques restudied. Electric & Electronics appliance parts.

熱硬化性樹脂の最近の技術動向 材料特性と成形技術の見直し 電気・電子部品
Author (2)：
AOKI MASAMITSU

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(東芝ケミカル)

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, 
OKUNOYAMA HIKARU

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(東芝ケミカル)

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Material：
プラスチックスエージ  (Plastics Age)

About プラスチックスエージ


Volume： 35  Issue： 11  Page： 143-155  Publication year： Nov. 1989 
JST Material Number： G0951A  ISSN： 0551-0503  CODEN： PUEJDH  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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thermosetting plastic

About thermosetting plastic

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
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All keywords is available on JDreamIII(charged).
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チップ【IC】

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JST classification (2)：
JST classification
Category name(code) classified by JST.
Other products,semiproducts and uses 
(YH06080T)

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,  Electric and electronic parts in general 
(NA05010H)

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Terms in the title (4)：
Terms in the title
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熱硬化性樹脂

About 熱硬化性樹脂

, 
技術動向

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, 
材料特性

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, 
電気・電子部品

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