Art
J-GLOBAL ID：200902022707894631   Reference number：87A0090253

Dielectric analysis of thermoset cure.

熱硬化橋かけの誘電的分析
Author (2)：
SENTURIA S D

About SENTURIA S D

(Massachusetts Inst. Technology, MA, USA)

About Massachusetts Inst. Technology, MA, USA

, 
SHEPPARD N F JR

About SHEPPARD N F JR

(Massachusetts Inst. Technology, MA, USA)

About Massachusetts Inst. Technology, MA, USA


Material：
Advances in Polymer Science  (Fortschritte der Hochpolymeren-Forschung)

About Advances in Polymer Science


Volume： 80  Page： 1-47  Publication year： 1986 
JST Material Number： C0099A  ISSN： 0065-3195  Document type： Article
Article type： 文献レビュー  Country of issue： Switzerland (CHE)  Language： ENGLISH (EN)
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thermosetting plastic

About thermosetting plastic

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
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crosslinking

About crosslinking


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JST classification (1)：
JST classification
Category name(code) classified by JST.
Reaction of polymers with low molecular weight compounds 
(CG03020L)

About Reaction of polymers with low molecular weight compounds

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
熱硬化

About 熱硬化

, 
橋かけ

About 橋かけ

, 
分析

About 分析


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