Art
J-GLOBAL ID：200902034926299054   Reference number：90A0744843

Twist-off testing of solder joint interconnections.

はんだ接続のtwist-off試験
Author (1)：
SUHIR E

About SUHIR E

(AT&T Bell Lab., New Jersey)

About AT&T Bell Lab., New Jersey


Material：
Journal of Electronic Packaging  (Transactions of the ASME. Journal of Electronic Packaging)

About Journal of Electronic Packaging


Volume： 111  Issue： 3  Page： 165-171  Publication year： Sep. 1989 
JST Material Number： T0929A  ISSN： 1043-7398  CODEN： JEPAE4  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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soldering

About soldering

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
チップ【IC】

About チップ【IC】


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JST classification (2)：
JST classification
Category name(code) classified by JST.
Connecting parts 
(NA05050Z)

About Connecting parts

,  Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
はんだ

About はんだ

, 
Twist

About Twist

, 
試験

About 試験


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