SOI by wafer bonding with spin-on glass as adhesive.

YAMADA A; KAWASAKI T; KAWASHIMA M

Art

J-GLOBAL ID：200902039149779596 Reference number：87A0479317

SOI by wafer bonding with spin-on glass as adhesive.

接着剤としてのスピンオン・ガラス(SOG)によるウエハボンディングによるSOI

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Author (3)： , ,
Material：
Volume： 23 Issue： 1 Page： 39-40 Publication year： Jan. 02, 1987
JST Material Number： A0887A ISSN： 0013-5194 CODEN： ELLEAK Document type： Article
Article type：短報 Country of issue： United Kingdom (GBR) Language： ENGLISH (EN)

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Manufacturing technology of solid-state devices

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