Art
J-GLOBAL ID:200902039149779596   Reference number:87A0479317

SOI by wafer bonding with spin-on glass as adhesive.

接着剤としてのスピンオン・ガラス(SOG)によるウエハボンディングによるSOI
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Volume: 23  Issue:Page: 39-40  Publication year: Jan. 02, 1987 
JST Material Number: A0887A  ISSN: 0013-5194  CODEN: ELLEAK  Document type: Article
Article type: 短報  Country of issue: United Kingdom (GBR)  Language: ENGLISH (EN)
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Manufacturing technology of solid-state devices 
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