Art
J-GLOBAL ID：200902046051754389   Reference number：82A0464706

Adhesion-promoting copper oxide for plastic on multilayer circuit boards.

多層プリント基板のプラスチックへの密着性を向上させる酸化銅
Author (2)：
SLOMINSKI L J

About SLOMINSKI L J

(MacDermid, Inc., CT)

About MacDermid, Inc., CT

, 
LANDAU A

About LANDAU A

(Autoyre Co., CT)

About Autoyre Co., CT


Material：
Plating & Surface Finishing  (Plat Surf Finish)

About Plating & Surface Finishing


Volume： 69  Issue： 6  Page： 96-99  Publication year： Jun. 1982 
JST Material Number： D0341A  ISSN： 0360-3164  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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multilayer interconnection

About multilayer interconnection

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
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energy saving

About energy saving

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Conversion treatment 
(WC08050J)

About Conversion treatment

,  Printed circuits 
(NA05040O)

About Printed circuits

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
多層プリント基板

About 多層プリント基板

, 
プラスチック

About プラスチック

, 
密着性

About 密着性

, 
酸化銅

About 酸化銅


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