Art
J-GLOBAL ID：200902057773597530   Reference number：83A0024621

Reliability hazards of silver-aluminum substrate bonds in MOS devices.

MOS素子における銀-アルミニウムの基板ボンドの信頼性ハザード
Author (2)：
SHUKLA R

About SHUKLA R

(Intel Corp., CA)

About Intel Corp., CA

, 
DEO J S

About DEO J S

(Intel Corp., CA)

About Intel Corp., CA


Material：
Annual Proceedings. IEEE International Reliability Physics Symposium  (IRPS)

About Annual Proceedings. IEEE International Reliability Physics Symposium


Volume： 20th  Page： 122-127  Publication year： 1982 
JST Material Number： A0631A  ISSN： 1541-7026  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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MOS integrated circuit

About MOS integrated circuit

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
MOS素子

About MOS素子

, 
銀

About 銀

, 
アルミニウム

About アルミニウム

, 
ボンド

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, 
ハザード

About ハザード


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