Art
J-GLOBAL ID：200902067156256969   Reference number：92A0408856

X-ray diffraction and thermal wave analysis of primary recrystallization in electrodeposited copper layers at room temperature.

室温で電着した銅層中の一次再結晶のX線回折と熱波解析
Author (2)：
SURNEV S

About SURNEV S

(Sofia Univ., Sofia, BGR)

About Sofia Univ., Sofia, BGR

, 
TOMOV I

About TOMOV I

(Inst. Physical Chemistry, Bulgarian Academy of Sciences, Sofia, BGR)

About Inst. Physical Chemistry, Bulgarian Academy of Sciences, Sofia, BGR


Material：
Journal of Applied Electrochemistry  (J Appl Electrochem)

About Journal of Applied Electrochemistry


Volume： 22  Issue： 5  Page： 464-470  Publication year： May. 1992 
JST Material Number： B0393B  ISSN： 0021-891X  Document type： Article
Article type： 原著論文  Country of issue： Netherlands (NLD)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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electrodeposition

About electrodeposition

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Electroplating 
(WC08023B)

About Electroplating

Terms in the title (7)：
Terms in the title
Keywords automatically extracted from the title.
室温

About 室温

, 
電着

About 電着

, 
銅層

About 銅層

, 
一次再結晶

About 一次再結晶

, 
X線回折

About X線回折

, 
熱波

About 熱波

, 
解析

About 解析


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