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J-GLOBAL ID：200902067876112042   Reference number：86A0376870

Effects of stoichiometric mixing ratio on epoxy cure - a dielectric analysis.

エポキシ橋かけに及ぼす化学量論的混合比の影響-誘電率解析
Author (1)：
DAY D R

About DAY D R

(Micromet Instruments Inc., Massachusetts)

About Micromet Instruments Inc., Massachusetts


Material：
Polymer Engineering & Science  (Polym Eng Sci)

About Polymer Engineering & Science


Volume： 26  Issue： 5  Page： 362-366  Publication year： Mar. 1986 
JST Material Number： C0640A  ISSN： 0032-3888  CODEN： PYESA  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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epoxy resin

About epoxy resin

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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crosslinking

About crosslinking

,...
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JST classification (3)：
JST classification
Category name(code) classified by JST.
Reaction of polymers with low molecular weight compounds 
(CG03020L)

About Reaction of polymers with low molecular weight compounds

,  Crosslinking 
(YH04100E)

About Crosslinking

,  Analysis of chemical process 
(XC01030R)

About Analysis of chemical process

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
橋かけ

About 橋かけ

, 
混合比

About 混合比

, 
誘電率

About 誘電率

, 
解析

About 解析


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