Art
J-GLOBAL ID:200902069365205380   Reference number:91A0659795

Activation energy for electromigration in Cu films.

Cu膜でのエレクトロマイグレーションの活性化エネルギー
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Volume: 59  Issue:Page: 175-177  Publication year: Jul. 08, 1991 
JST Material Number: H0613A  ISSN: 0003-6951  CODEN: APPLAB  Document type: Article
Article type: 短報  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Diffusion in metals  ,  General 
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