Art
J-GLOBAL ID：200902069365205380   Reference number：91A0659795

Activation energy for electromigration in Cu films.

Cu膜でのエレクトロマイグレーションの活性化エネルギー
Author (2)：
PARK C W

About PARK C W

(Syracuse Univ., New York)

About Syracuse Univ., New York

, 
VOOK R W

About VOOK R W

(Syracuse Univ., New York)

About Syracuse Univ., New York


Material：
Applied Physics Letters  (Appl Phys Lett)

About Applied Physics Letters


Volume： 59  Issue： 2  Page： 175-177  Publication year： Jul. 08, 1991 
JST Material Number： H0613A  ISSN： 0003-6951  CODEN： APPLAB  Document type： Article
Article type： 短報  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
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Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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electrotransport

About electrotransport

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Diffusion in metals 
(BL06022C)

About Diffusion in metals

,  General 
(NC03161C)

About General

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
Cu

About Cu

, 
エレクトロマイグレーション

About エレクトロマイグレーション

, 
活性化エネルギー

About 活性化エネルギー


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