Art
J-GLOBAL ID：200902074454193607   Reference number：92A0710880

Surface Laminar Circuit Packaging.

表面積層回路実装
Author (3)：
TSUKADA Y

About TSUKADA Y

(IBM Japan, Shiga-ken, JPN)

About IBM Japan, Shiga-ken, JPN

, 
TSUCHIDA S

About TSUCHIDA S

(IBM Japan, Shiga-ken, JPN)

About IBM Japan, Shiga-ken, JPN

, 
MASHIMOTO Y

About MASHIMOTO Y

(IBM Japan, Shiga-ken, JPN)

About IBM Japan, Shiga-ken, JPN


Material：
Proceedings. Electronic Components & Technology Conference  (IEEE Electronic Components and Technology Conference)

About Proceedings. Electronic Components & Technology Conference


Volume： 42nd  Page： 22-27  Publication year： 1992 
JST Material Number： H0393A  ISSN： 0569-5503  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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surface mount technology

About surface mount technology

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
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On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
SMD

About SMD


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JST classification (1)：
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Printed circuits 
(NA05040O)

About Printed circuits

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回路実装

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