Art
J-GLOBAL ID：200902075699455611   Reference number：90A0163017

Thermal expansion behavior of glass/epoxy resin laminated board.

ガラス/エポキシ樹脂積層板の熱膨張挙動
Author (3)：
KIKUCHI TAKUMI

About KIKUCHI TAKUMI

(三菱電機 生産技研)

About 三菱電機 生産技研

, 
TAKAHAMA TAKASHI

About TAKAHAMA TAKASHI

(三菱電機 生産技研)

About 三菱電機 生産技研

, 
NAKAJIMA HIROYUKI

About NAKAJIMA HIROYUKI

(三菱電機 生産技研)

About 三菱電機 生産技研


Material：
プリント回路学会学術講演大会講演論文集

About プリント回路学会学術講演大会講演論文集


Volume： 4th  Page： 153-154  Publication year： Nov. 1989 
JST Material Number： X0498A  Document type： Proceedings
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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All keywords is available on JDreamIII(charged).
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printed board

About printed board

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
thermal measurement

About thermal measurement


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JST classification (1)：
JST classification
Category name(code) classified by JST.
Printed circuits 
(NA05040O)

About Printed circuits

Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
ガラス

About ガラス

, 
エポキシ樹脂

About エポキシ樹脂

, 
積層板

About 積層板

, 
熱膨張

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, 
挙動

About 挙動


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