Art
J-GLOBAL ID：200902077416446339   Reference number：90A0445049

Electronics adhesive.

特集 新しい接着剤の化学と技術 エレクトロニクス用接着剤
Author (1)：
OKUNOYAMA HIKARU

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(東芝ケミカル)

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Material：
化学工業  (Chemical Industry)

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Volume： 41  Issue： 5  Page： 399-409  Publication year： May. 1990 
JST Material Number： F0101A  ISSN： 0451-2014  CODEN： KAKOA  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
adhesion (bond)

About adhesion (bond)

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
heat conduction

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JST classification (1)：
JST classification
Category name(code) classified by JST.
Various adhesives 
(YK03000X)

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Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
接着剤

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, 
化学

About 化学

, 
エレクトロニクス

About エレクトロニクス


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