Art
J-GLOBAL ID：200902082113600339
Reference number：86A0377276
Present state and future perspective of semiconductor sealing material. Possibility of engineering plastics as a post-epoxy resin.
半導体封止材料の現状と展望 ポスト・エポキシとしてのエンジニアリングプラスチックスの可能性
Author (1)：
Material：
Volume：
34
Issue：
7
Page：
101-111
Publication year：
Jul. 1986
JST Material Number：
F0172A
ISSN：
0452-2834
CODEN：
KZAIA
Document type：
Article
Article type：
解説
Country of issue：
Japan (JPN)
Language：
JAPANESE (JA)
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Electric insulating materials
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