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J-GLOBAL ID：200902087631141765   Reference number：86A0275910

Wafer bonding for silicon-on-insulator technologies.

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Author (1)：
LASKY J B

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(IBM, Vermont)

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Material：
Applied Physics Letters  (Appl Phys Lett)

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Volume： 48  Issue： 1  Page： 78-80  Publication year： Jan. 06, 1986 
JST Material Number： H0613A  ISSN： 0003-6951  CODEN： APPLAB  Document type： Article
Article type： 短報  Country of issue： United States (USA)  Language： ENGLISH (EN)
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semiconductor junction

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,...
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JST classification (2)：
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Manufacturing technology of solid-state devices 
(NC03030V)

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,  金属-絶縁体-半導体構造【’81~’92】 
(BM03074V)

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SOI技術

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