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J-GLOBAL ID:200902087631141765   Reference number:86A0275910

Wafer bonding for silicon-on-insulator technologies.

SOI技術のためのウェハボンディング
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Volume: 48  Issue:Page: 78-80  Publication year: Jan. 06, 1986 
JST Material Number: H0613A  ISSN: 0003-6951  CODEN: APPLAB  Document type: Article
Article type: 短報  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Manufacturing technology of solid-state devices  ,  金属-絶縁体-半導体構造【’81~’92】 
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