Art
J-GLOBAL ID：200902091380329759   Reference number：92A0319014

Current distribution simulation for an electrolytic cell.(1).Properties of plating solution and current distribution.

電解槽の電流分布シミュレーション(1) めっき液の性質と電流分布
Author (1)：
OBARA KATSUHIKO

About OBARA KATSUHIKO

(上村工業 中研)

About 上村工業 中研


Material：
ウエムラ・テクニカルレポ-ト

About ウエムラ・テクニカルレポ-ト


Issue： 24  Page： 11-16  Publication year： Mar. 1992 
JST Material Number： L0887A  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
Thesaurus term：
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electrolytic cell

About electrolytic cell

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Electroplating 
(WC08023B)

About Electroplating

Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
電解槽

About 電解槽

, 
電流分布

About 電流分布

, 
シミュレーション

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, 
めっき液

About めっき液

, 
性質

About 性質


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