Art
J-GLOBAL ID：200902094324548498   Reference number：88A0121044

Resin-insertion effect on thermal cycle resistivity of flip-chip mounted LSI devices.

フリップチップ法で実装したLSIデバイスの熱サイクル抵抗に関する樹脂充填効果
Author (3)：
NAKANO F

About NAKANO F

(Hitachi Ltd., Hitachi, JPN)

About Hitachi Ltd., Hitachi, JPN

, 
SOGA T

About SOGA T

(Hitachi Ltd., Hitachi, JPN)

About Hitachi Ltd., Hitachi, JPN

, 
AMAGI S

About AMAGI S

(Hitachi Ltd., Hitachi, JPN)

About Hitachi Ltd., Hitachi, JPN


Material：
Proceedings of the International Symposium on Microelectronics  (ISHM)

About Proceedings of the International Symposium on Microelectronics


Volume： 1987  Page： 536-541  Publication year： 1987 
JST Material Number： A0946B  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
LSI

About LSI

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
thermal fatigue

About thermal fatigue

,...
   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=88A0121044&from=J-GLOBAL&jstjournalNo=A0946B") }}
JST classification (1)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
フリップチップ法

About フリップチップ法

, 
実装

About 実装

, 
LSI

About LSI

, 
熱サイクル

About 熱サイクル


Return to Previous Page

TOP

BOTTOM