Art
J-GLOBAL ID：200902097903506178
Reference number：90A0753870
Mirror surface grinding of silicon wafers with electrolytic in-process dressing.
電解インプロセス・ドレッシング法によるシリコンウエハの鏡面研削
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Author (2)：
,
Material：
Volume：
39
Issue：
1
Page：
329-332
Publication year：
1990
JST Material Number：
E0026A
ISSN：
0007-8506
Document type：
Article
Article type：
原著論文
Country of issue：
United Kingdom (GBR)
Language：
ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices
, Grinding
Terms in the title (5)：
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