Art
J-GLOBAL ID：200902101897590797   Reference number：95A0688416

Electroless copper deposition for ULSI.

ULSI用の銅の無電解めっき
Author (3)：
SHACHAM-DIAMAND Y

About SHACHAM-DIAMAND Y

(Cornell Univ., NY, USA)

About Cornell Univ., NY, USA

, 
DUBIN V

About DUBIN V

(Cornell Univ., NY, USA)

About Cornell Univ., NY, USA

, 
ANGYAL M

About ANGYAL M

(Cornell Univ., NY, USA)

About Cornell Univ., NY, USA


Material：
Thin Solid Films

About Thin Solid Films


Volume： 262  Issue： 1/2  Page： 93-103  Publication year： Jun. 15, 1995 
JST Material Number： B0899A  ISSN： 0040-6090  Document type： Article
Article type： 文献レビュー  Country of issue： Netherlands (NLD)  Language： ENGLISH (EN)
Thesaurus term：
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All keywords is available on JDreamIII(charged).
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electroless plating

About electroless plating

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices 
(NC03030V)

About Manufacturing technology of solid-state devices

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
ULSI

About ULSI

, 
銅

About 銅

, 
無電解めっき

About 無電解めっき


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