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J-GLOBAL ID：200902106657297393   Reference number：02A0734362

Lead-Free Electronics Packaging. Thermodynamic Calculation of Phase Diagram in the Bi-In-Sb Ternary System.

Bi-In-Sb3元系における状態図の熱力学計算

Author (7)： CUI Y (Tohoku Univ., Sendai, JPN) ,  ISHIHARA S (Japan Sci. and Technol. Corp.) ,  LIU X J (Tohoku Univ., Sendai, JPN) ,  OHNUMA I (Tohoku Univ., Sendai, JPN) ,  KAINUMA R (Tohoku Univ., Sendai, JPN) ,  OHTANI H (Tohoku Univ., Sendai, JPN) ,  ISHIDA K (Tohoku Univ., Sendai, JPN)
Material： Materials Transactions  (Mater Trans)
Volume： 43  Issue： 8  Page： 1879-1886  Publication year： Aug. 20, 2002 
JST Material Number： G0668A  ISSN： 1345-9678  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *solder ,...

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JST classification (2)： Brazing  (WC07050C) ,  Phase equilibrium,phase diagram of metallic systems  (CB03012T)

Reference (26)：

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• 2) N. Saunders and A. P. Miodownik: CALPHAD (Lausanne, Switzerland Pergamon, 1998).
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• 4) X. J. Liu, S. L. Chen, I. Ohnuma, K. Ishida and Y. A. Chang: Mechanics and Material Engineering for Science and Experiments, ed. by Y. C. Zhou, Y. Gu and Z. Li (Science Press, 2001) pp. 334–337.
• 5) B. Joukoff and A. M. Jean-Louis: J. Crystal Growth 12 (1972) 169–172.

Terms in the title (3)： Bi ,  状態図 ,  熱力学計算