Art
J-GLOBAL ID：200902107899502940   Reference number：01A0040009

Isotropic Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers.

低融点合金フィラーを含有する等方導電性接着剤
Author (2)：
LU D

About LU D

(Georgia Inst. Technol., GA, USA)

About Georgia Inst. Technol., GA, USA

, 
WONG C P

About WONG C P

(Georgia Inst. Technol., GA, USA)

About Georgia Inst. Technol., GA, USA


Material：
IEEE Transactions on Electronics Packaging Manufacturing  (IEEE Trans Electron Packag Manuf)

About IEEE Transactions on Electronics Packaging Manufacturing


Volume： 23  Issue： 3  Page： 185-190  Publication year： Jul. 2000 
JST Material Number： W1131A  ISSN： 1521-334X  CODEN： ITEPFL  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
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*conducting polymer

About conducting polymer

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
crosslinking

About crosslinking

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Connecting parts 
(NA05050Z)

About Connecting parts

,  Various adhesives 
(YK03000X)

About Various adhesives

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
低融点合金

About 低融点合金

, 
フィラー

About フィラー

, 
導電性接着剤

About 導電性接着剤


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