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J-GLOBAL ID:200902109934342090   Reference number:97A0829977

Life prediction modeling of solder interconnects for electronic systems.

電子システム用のはんだ相互接続の寿命予測モデリング
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Material:
Volume: 19  Issue: Volume 2  Page: 1515-1522  Publication year: 1997 
JST Material Number: W0624A  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Brazing  ,  Metallic materials  ,  Measurement,testing and reliability of solid-state devices  ,  Connecting parts 
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