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J-GLOBAL ID:200902110885004603   Reference number:00A0718332

Measurement of Biaxial Stress Using Electrodeposited Copper Foil with a Microcircular Hole. 5th Report. Effect of Modulus of Elasticity of the Material.

微小円孔を有する電着銅薄膜による二軸応力検出法 第5報 被測定物の弾性係数の影響
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Volume: 66  Issue: 647  Page: 1398-1403  Publication year: Jul. 25, 2000 
JST Material Number: F0227B  ISSN: 0387-5008  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Material testing  ,  Metallic thin films 

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