Art
J-GLOBAL ID：200902111415105450   Reference number：95A0548120

Metallurgy of low temperature Pb-free solders for electronic assembly.

電子部品組立てのための低温用無Pbはんだの冶金学
Author (1)：
GLAZER J

About GLAZER J

(Hewlett-Packard Co., CA, USA)

About Hewlett-Packard Co., CA, USA


Material：
International Materials Reviews  (Int Mater Rev)

About International Materials Reviews


Volume： 40  Issue： 2  Page： 65-93  Publication year： 1995 
JST Material Number： D0258B  ISSN： 0950-6608  CODEN： INMREO  Document type： Article
Article type： 文献レビュー  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
solder

About solder

,...
   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=95A0548120&from=J-GLOBAL&jstjournalNo=D0258B") }}
JST classification (2)：
JST classification
Category name(code) classified by JST.
Brazing 
(WC07050C)

About Brazing

,  Printed circuits 
(NA05040O)

About Printed circuits

Terms in the title (6)：
Terms in the title
Keywords automatically extracted from the title.
電子部品

About 電子部品

, 
組立て

About 組立て

, 
低温

About 低温

, 
Pb

About Pb

, 
はんだ

About はんだ

, 
冶金学

About 冶金学


Return to Previous Page

TOP

BOTTOM