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J-GLOBAL ID:200902123220071240   Reference number:94A0916634

Preparation of Copper Films by the Two-Liquid-lnterface Electrodeposition.

二液相界面における電析による銅薄膜の製造
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Material:
Volume: 33  Page: 175-181  Publication year: Sep. 1994 
JST Material Number: S0603A  ISSN: 0370-985X  Document type: Proceedings
Article type: 原著論文  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Metallic thin films  ,  Electrochemical reaction 
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