Propagation Layers for Intra-Chip Wireless Interconnection Compatible with Packaging and Heat Removal.

GUO X; CASERTA J; LI R; FLOYD B; O K K

Art

J-GLOBAL ID：200902125846339948 Reference number：02A0633869

Propagation Layers for Intra-Chip Wireless Interconnection Compatible with Packaging and Heat Removal.

パッケージングと熱除去と両立するチップ内無線相互接続用の伝搬層

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Author (5)： , , , ,
Material：
Volume： 2002 Page： 36-37 Publication year： 2002
JST Material Number： A0035B ISSN： 0743-1562 Document type： Proceedings
Article type：短報 Country of issue： United States (USA) Language： ENGLISH (EN)

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Manufacturing technology of solid-state devices , Semiconductor integrated circuit

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