New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method.

MATSUMOTO T; SATOH M; SAKUMA K; KURINO H; MIYAKAWA N; ITANI H; KOYANAGI M

Art

J-GLOBAL ID：200902126979947360 Reference number：98A0527373

New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method.

接着剤注入法を用いた新しい三次元ウエハ接着技術

Publisher site Copy service {{ this.onShowCLink("http://jdream3.com/copy/?sid=JGLOBAL&noSystem=1&documentNoArray=98A0527373&COPY=1") }}
Access JDreamⅢ for advanced search and analysis. {{ this.onShowJLink("http://jdream3.com/lp/jglobal/index.html?docNo=98A0527373&from=J-GLOBAL&jstjournalNo=G0520B") }}

Author (7)： , , , , , ,
Material：
Volume： 37 Issue： 3B Page： 1217-1221 Publication year： Mar. 1998
JST Material Number： G0520B ISSN： 0021-4922 Document type： Article
Article type：原著論文 Country of issue： Japan (JPN) Language： ENGLISH (EN)

,...

To see more with JDream III (charged). {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=98A0527373&from=J-GLOBAL&jstjournalNo=G0520B") }}

Manufacturing technology of solid-state devices

Reference (7)：

1) Y. Akasaka: Proc. IEEE 74 (1983) 1703.
2) K. Kioi, T. Shinozaki, S. Toyoyama, K. Shirakawa, K. Ohtake and S. Tsuchimoto: IEEE J. Solid-State Circuits 27 (1992) 1130.
3) T. Matsumoto Y. Kudoh, T. Tahara, K. -H.Yu, N. Miyakawa, H. Itani, T. Ichikizaki, A. Fujiwara, H. Tsukamoto and M. Koyanagi: Ext. Abstr. 1996 Int. Conf. Solid State Devices and Materials (Business Center for Academic Societies Japan, Tokyo, 1996) p. 1073.
4) K-H. Yu, D. Doi, M. Tahara, Y. Kudoh, T. Matsumoto and M. Koyanagi: Proc. Int. Symp. Microsystems, Intelligent Materials and Robots (1995) Vol. 7, p. 382.
5) K.-H. Yu, Y. Kudoh, T. Matsumoto, S. Pidin and M. Koyanagi: J. Intelligent Mater. Syst. & Struct. <b>7</b> (1996) 342.

ｍore...

, ,

Return to Previous Page