Art
J-GLOBAL ID：200902127264781150   Reference number：02A0486989

Current Trends in Patterning with Copper.

銅を用いたパターン化の最近の動向
Author (2)：
RICKERBY J

About RICKERBY J

(Imperial Coll. Sci., Technol. and Medicine, London, GBR)

About Imperial Coll. Sci., Technol. and Medicine, London, GBR

, 
STEINKE J H G

About STEINKE J H G

(Imperial Coll. Sci., Technol. and Medicine, London, GBR)

About Imperial Coll. Sci., Technol. and Medicine, London, GBR


Material：
Chemical Reviews  (Chem Rev)

About Chemical Reviews


Volume： 102  Issue： 5  Page： 1525-1549  Publication year： May. 2002 
JST Material Number： B0256A  ISSN： 0009-2665  CODEN： CHREAY  Document type： Article
Article type： 文献レビュー  Country of issue： United States (USA)  Language： ENGLISH (EN)
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microelectronics

About microelectronics

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
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JST classification (4)：
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices 
(NC03030V)

About Manufacturing technology of solid-state devices

,  Plating in general 
(WC08021T)

About Plating in general

,  Electrochemical reaction 
(CB07050F)

About Electrochemical reaction

,  Metallic thin films 
(BK14030T)

About Metallic thin films

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
銅

About 銅

, 
パターン化

About パターン化

, 
動向

About 動向


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