Art
J-GLOBAL ID：200902127473773998   Reference number：95A0190670

Low Temperature Bonding of Cu on Si3N4 Using Laser Ablation Process.

レーザアブレーションによる窒化ケイ素と純銅の低温接合
Author (4)：
YANO TETSUO

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(四国工技研)

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, 
OIE TOSHIHIKO

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(四国工技研)

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, 
YONEDA MASAFUMI

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(四国工技研)

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, 
KATSUMURA MUNEHIDE

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(四国工技研)

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Material：
日本金属学会誌  (Journal of the Japan Institute of Metals and Materials)

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Volume： 59  Issue： 1  Page： 89-93  Publication year： Jan. 1995 
JST Material Number： G0023A  ISSN： 0021-4876  CODEN： NIKGAV  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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silicon nitride

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,...
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Laser irradiation effects and damages 
(BK16040S)

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Terms in the title (4)：
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レーザアブレーション

About レーザアブレーション

, 
窒化ケイ素

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, 
純銅

About 純銅

, 
低温接合

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