Art
J-GLOBAL ID：200902128186965319
Reference number：97A0476813
Preparation of WNx Films and Their Diffusion Barrier Properties in Cu/Si Contact Systems.
WNx膜の作製とCu/Si接触系におけるその拡散障壁としての性質
-
Publisher site
Copy service
{{ this.onShowCLink("http://jdream3.com/copy/?sid=JGLOBAL&noSystem=1&documentNoArray=97A0476813©=1") }}
-
Access JDreamⅢ for advanced search and analysis.
{{ this.onShowJLink("http://jdream3.com/lp/jglobal/index.html?docNo=97A0476813&from=J-GLOBAL&jstjournalNo=G0520B") }}
Author (2)：
,
Material：
Volume：
36
Issue：
4A
Page：
2261-2266
Publication year：
Apr. 1997
JST Material Number：
G0520B
ISSN：
0021-4922
Document type：
Article
Article type：
原著論文
Country of issue：
Japan (JPN)
Language：
ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
,...
JST classification (2)：
JST classification
Category name(code) classified by JST.
Metallic thin films
, Semiconductor-metal contacts
Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
,
,
,
,
Return to Previous Page
