Art
J-GLOBAL ID：200902131620653062   Reference number：94A0642071

Trends in New Technologies of MCM.

特集 MCM技術 1 MCM基板 MCM技術の動向
Author (1)：
HONDA SUSUMU

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(エス・シー・ラボラトリー)

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Material：
SHM会誌  (Journal of SHM (Society for Hybrid Microelectronics))

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Volume： 10  Issue： 4  Page： 10-18  Publication year： Jul. 1994 
JST Material Number： S0579B  ISSN： 0919-4398  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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multichip packaging

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,...
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Thesaurus term/Semi thesaurus term
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ベアチップ実装

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JST classification (1)：
JST classification
Category name(code) classified by JST.
Hydrid integrated circuit 
(NC03163K)

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Reference (4)：
  • 1) 塚田: 第23回インターネプコンセミナー, SMT5, (1994) , p. 39, 工業調査会.
  • 2) K. Gilleo : Electronic Packaging & Production, (1993) , p . 88, Cahners Publishing Company.
  • 3) 頼, 他: サーキットテクノロジ, 8 (2) , (1993) , p. 136, プリント回路学会.
  • 4) Y.Tsukada, et al : Proc. 7th IMC, (1992) , p. 252, SHM.
Terms in the title (2)：
Terms in the title
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MCM

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, 
動向

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