Art
J-GLOBAL ID:200902131834336609   Reference number:93A0681560

Study of Fatigue Crack Propagation Behavior of Film Materials. Fatigue Testing Method and Factors Controlling Fatigue crack Propagation Rates.

膜材の疲労き裂伝ぱ挙動に関する研究 疲労試験法と疲労き裂伝ぱ速度の支配要因
Author (4):
Material:
Volume: 59  Issue: 563  Page: 1575-1581  Publication year: Jul. 1993 
JST Material Number: F0227B  ISSN: 0387-5008  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Semi thesaurus term:
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.

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JST classification (2):
JST classification
Category name(code) classified by JST.
Metallic materials  ,  Electric and electronic parts in general 
Reference (23):
  • (1) William D. Nix, Metall. Trans., A, 20-11(1989), 2217.
  • (2) Ikegami, K., Advances in Electronic Packaging, ASME, 1(1992), 567.
  • (3) 河合,材料力学講演会講演論文集, No,910-71, A(1991-11), 494.
  • (4) 尾田•ほか3名,機論, 57-541, A(1991), 2050.
  • (5) 中山•ほか3名,材料, 41-466(1992), 1040.
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