Art
J-GLOBAL ID:200902132293132459   Reference number:00A0970005

Fatigue Life Analysis of Solder Joints in Flip Chip Bonding.

フリップチップボンディングのはんだ接合部の疲労寿命解析
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Volume: 122  Issue:Page: 207-213  Publication year: Sep. 2000 
JST Material Number: T0929A  ISSN: 1043-7398  CODEN: JEPAE4  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Manufacturing technology of solid-state devices  ,  Connecting parts  ,  Measurement,testing and reliability of solid-state devices 
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