Art
J-GLOBAL ID：200902132293132459   Reference number：00A0970005

Fatigue Life Analysis of Solder Joints in Flip Chip Bonding.

フリップチップボンディングのはんだ接合部の疲労寿命解析
Author (4)：
TSUKADA Y

About TSUKADA Y

(IBM, Shiga-ken, JPN)

About IBM, Shiga-ken, JPN

, 
NISHIMURA H

About NISHIMURA H

(IBM, Shiga-ken, JPN)

About IBM, Shiga-ken, JPN

, 
SAKANE M

About SAKANE M

(Ritsumeikan Univ., Shiga-ken, JPN)

About Ritsumeikan Univ., Shiga-ken, JPN

, 
OHNAMI M

About OHNAMI M

(Ritsumeikan Univ., Shiga-ken, JPN)

About Ritsumeikan Univ., Shiga-ken, JPN


Material：
Journal of Electronic Packaging  (Transactions of the ASME. Journal of Electronic Packaging)

About Journal of Electronic Packaging


Volume： 122  Issue： 3  Page： 207-213  Publication year： Sep. 2000 
JST Material Number： T0929A  ISSN： 1043-7398  CODEN： JEPAE4  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
*flip chip method

About flip chip method

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
疲労寿命解析

About 疲労寿命解析

,...
   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=00A0970005&from=J-GLOBAL&jstjournalNo=T0929A") }}
JST classification (3)：
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices 
(NC03030V)

About Manufacturing technology of solid-state devices

,  Connecting parts 
(NA05050Z)

About Connecting parts

,  Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
フリップチップボンディング

About フリップチップボンディング

, 
はんだ接合部

About はんだ接合部

, 
疲労寿命

About 疲労寿命

, 
解析

About 解析


Return to Previous Page

TOP

BOTTOM