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J-GLOBAL ID：200902133428554142   Reference number：99A0549436

The effect of surface roughness on direct wafer bonding.

直接ウエハボンディングに及ぼす表面粗さの影響
Author (4)：
GUI C

About GUI C

(Univ. Twente, NLD)

About Univ. Twente, NLD

, 
ELWENSPOEK M

About ELWENSPOEK M

(Univ. Twente, NLD)

About Univ. Twente, NLD

, 
TAS N

About TAS N

(Univ. Twente, NLD)

About Univ. Twente, NLD

, 
GARDENIERS J G E

About GARDENIERS J G E

(Univ. Twente, NLD)

About Univ. Twente, NLD


Material：
Journal of Applied Physics  (Journal of General Physics and its Application to Other Sciences and to Industry)

About Journal of Applied Physics


Volume： 85  Issue： 10  Page： 7448-7454  Publication year： May. 15, 1999 
JST Material Number： C0266A  ISSN： 0021-8979  CODEN： JAPIAU  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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*bonding

About bonding

,...
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JST classification (1)：
JST classification
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Manufacturing technology of solid-state devices 
(NC03030V)

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ウエハボンディング

About ウエハボンディング

, 
表面粗さ

About 表面粗さ


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