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J-GLOBAL ID:200902133428554142   Reference number:99A0549436

The effect of surface roughness on direct wafer bonding.

直接ウエハボンディングに及ぼす表面粗さの影響
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Volume: 85  Issue: 10  Page: 7448-7454  Publication year: May. 15, 1999 
JST Material Number: C0266A  ISSN: 0021-8979  CODEN: JAPIAU  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Manufacturing technology of solid-state devices 
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