Art
J-GLOBAL ID：200902135108967778   Reference number：96A0862143

Anisotropically Conductive Adhesive Flip-Chip Bonding on Rigid and Flexible Printed Circuit Substrates.

堅くて曲げやすいプリント回路基板上への異方的に伝導性の接着剤のフリップチップボンディング
Author (2)：
LAI Z

About LAI Z

(Swedish Inst. Production Engineering Res. (IVF), Moelndal, SWE)

About Swedish Inst. Production Engineering Res. (IVF), Moelndal, SWE

, 
LIU J

About LIU J

(Swedish Inst. Production Engineering Res. (IVF), Moelndal, SWE)

About Swedish Inst. Production Engineering Res. (IVF), Moelndal, SWE


Material：
IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B: Advanced Packaging  (IEEE Trans Compon Packag Manuf Technol Part B)

About IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B: Advanced Packaging


Volume： 19  Issue： 3  Page： 644-660  Publication year： Aug. 1996 
JST Material Number： W0590A  ISSN： 1070-9894  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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printed board

About printed board

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
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All keywords is available on JDreamIII(charged).
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SEM

About SEM

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Printed circuits 
(NA05040O)

About Printed circuits

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
プリント回路基板

About プリント回路基板

, 
接着剤

About 接着剤

, 
フリップチップボンディング

About フリップチップボンディング


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