Art
J-GLOBAL ID：200902144148948554   Reference number：96A0137833

Thermal Fatigue Life of Solder Bumps in BGA.

BGAはんだバンプ接合部の熱疲労寿命評価
Author (3)：
MUKAI MINORU

About MUKAI MINORU

(東芝)

About 東芝

, 
KAWAKAMI TAKASHI

About KAWAKAMI TAKASHI

(東芝)

About 東芝

, 
TAKAHASHI KUNIAKI

About TAKAHASHI KUNIAKI

(東芝)

About 東芝


Material：
日本機械学会計算力学講演会講演論文集  (日本機械学会計算力学講演会講演概要集)

About 日本機械学会計算力学講演会講演論文集


Volume： 8th  Page： 169-170  Publication year： Nov. 1995 
JST Material Number： L0203A  ISSN： 1348-026X  Document type： Proceedings
Article type： 短報  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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printed board

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,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
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All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
simulation test

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JST classification (1)：
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices 
(NC03030V)

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Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
BGA

About BGA

, 
はんだバンプ

About はんだバンプ

, 
接合部

About 接合部

, 
熱疲労

About 熱疲労

, 
寿命評価

About 寿命評価


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