Art
J-GLOBAL ID：200902145893336508   Reference number：96A0067132

Modeling and Analysis of Multichip Module Power Supply Planes.

マルチチップ実装との電源供給平面のモデル化と解析
Author (2)：
LEE K

About LEE K

(Hewlett-Packard Lab., CA, USA)

About Hewlett-Packard Lab., CA, USA

, 
BARBER A

About BARBER A

(Hewlett-Packard Lab., CA, USA)

About Hewlett-Packard Lab., CA, USA


Material：
IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B: Advanced Packaging  (IEEE Trans Compon Packag Manuf Technol Part B)

About IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B: Advanced Packaging


Volume： 18  Issue： 4  Page： 628-639  Publication year： Nov. 1995 
JST Material Number： W0590A  ISSN： 1070-9894  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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multichip packaging

About multichip packaging

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
スイッチング雑音

About スイッチング雑音


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JST classification (1)：
JST classification
Category name(code) classified by JST.
Printed circuits 
(NA05040O)

About Printed circuits

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
マルチチップ実装

About マルチチップ実装

, 
電源供給

About 電源供給

, 
モデル化

About モデル化

, 
解析

About 解析


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