Art
J-GLOBAL ID：200902149423357059   Reference number：96A0022674

The development of wire bonder for flash plating. Plating condition for obtaining optimum bonding strength.

フラッシュめっき対応ワイヤボンダーの開発 最適接合強度を得るためのめっき条件
Author (1)：
HAJI HIROSHI

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(九州松下電器)

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Material：
表面実装技術  (Surface Mount Technology)

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Volume： 5  Issue： 11  Page： 52-56  Publication year： Nov. 1995 
JST Material Number： L2473A  ISSN： 0917-5156  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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lead frame

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,...
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Thesaurus term/Semi thesaurus term
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All keywords is available on JDreamIII(charged).
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フラッシュめっき

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JST classification (1)：
JST classification
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Manufacturing technology of solid-state devices 
(NC03030V)

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Terms in the title (5)：
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フラッシュ

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, 
めっき

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, 
開発

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, 
接合強度

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, 
めっき条件

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