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J-GLOBAL ID:200902149826919197   Reference number:98A0985855

Analysis of Flow Between a Wafer and Pad During CMP Processes.

CMPプロセス中ウエハとパッド間のフロー分析
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Volume: 27  Issue: 10  Page: 1082-1087  Publication year: Oct. 1998 
JST Material Number: D0277B  ISSN: 0361-5235  Document type: Article
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Manufacturing technology of solid-state devices 
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