Art
J-GLOBAL ID：200902153939715862   Reference number：98A0264328

Analysis Cases of the Wire-bonded Interfaces.

表面分析のケーススタディ 2 ワイヤボンディング界面の分析事例
Author (1)：
HAJI HIROSHI

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(九州松下電器 生産技研)

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Material：
表面技術  (Journal of the Surface Finishing Society of Japan)

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Volume： 49  Issue： 2  Page： 166-171  Publication year： Feb. 1998 
JST Material Number： G0441B  ISSN： 0915-1869  CODEN： HYGIEX  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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*surface analysis

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,...
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displacement plating

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Manufacturing technology of solid-state devices 
(NC03030V)

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表面分析

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, 
ケーススタディ

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ワイヤボンディング

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界面

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分析

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