Art
J-GLOBAL ID：200902154255795570   Reference number：01A0386514

Amorphous carbon based materials as the interconnect dielectric in ULSI chips.

ULSIチップ中の相互接続誘電体としての非晶質炭素系材料
Author (1)：
GRILL A

About GRILL A

(IBM-Res. Div., NY, USA)

About IBM-Res. Div., NY, USA


Material：
Diamond and Related Materials  (Diam Relat Mater)

About Diamond and Related Materials


Volume： 10  Issue： 2  Page： 234-239  Publication year： Feb. 2001 
JST Material Number： W0498A  ISSN： 0925-9635  Document type： Article
Article type： 原著論文  Country of issue： Netherlands (NLD)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
VLSI

About VLSI

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Carbon and its compounds 
(YB02060D)

About Carbon and its compounds

,  Insulating materials 
(NA04030W)

About Insulating materials

Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
ULSI

About ULSI

, 
相互接続

About 相互接続

, 
誘電体

About 誘電体

, 
非晶質

About 非晶質

, 
炭素系材料

About 炭素系材料


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