Art
J-GLOBAL ID：200902155652009277   Reference number：99A1032269

Evaluating IC-Package Interface Delamination by Considering Moisture-Induced Molding-Compound Swelling.

水分によるモールド化合物の膨張を考慮したICパッケージ界面剥離の評価
Author (4)：
TANAKA N

About TANAKA N

(Hitachi, Ltd., JPN)

About Hitachi, Ltd., JPN

, 
KITANO M

About KITANO M

(Hitachi, Ltd., JPN)

About Hitachi, Ltd., JPN

, 
KUMAZAWA T

About KUMAZAWA T

(Akita Prefectural Univ., Akita, JPN)

About Akita Prefectural Univ., Akita, JPN

, 
NISHIMURA A

About NISHIMURA A

(Hitachi, Ltd., JPN)

About Hitachi, Ltd., JPN


Material：
IEEE Transactions on Components and Packaging Technologies  (IEEE Trans Compon Packag Technol)

About IEEE Transactions on Components and Packaging Technologies


Volume： 22  Issue： 3  Page： 426-432  Publication year： Sep. 1999 
JST Material Number： H0255C  ISSN： 1521-3331  CODEN： ITCPFB  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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*IC package

About IC package

,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

Terms in the title (6)：
Terms in the title
Keywords automatically extracted from the title.
水分

About 水分

, 
モールド

About モールド

, 
膨張

About 膨張

, 
ICパッケージ

About ICパッケージ

, 
界面剥離

About 界面剥離

, 
評価

About 評価


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