Art
J-GLOBAL ID：200902156123114339   Reference number：00A0711109

Microrelay Packaging Technology Using Flip-Chip Assembly.

フリップチップ組立を用いたマイクロリレーパッケージ技術
Author (3)：
MILLER D C

About MILLER D C

(Univ. Colorado, CO)

About Univ. Colorado, CO

, 
ZHANG W

About ZHANG W

(Univ. Colorado, CO)

About Univ. Colorado, CO

, 
BRIGHT V M

About BRIGHT V M

(Univ. Colorado, CO)

About Univ. Colorado, CO


Material：
IEEE Annual International Conference on Micro Electro Mechanical Systems  (Proceedings. IEEE Annual International Conference on Micro Electro Mechanical Systems)

About IEEE Annual International Conference on Micro Electro Mechanical Systems


Volume： 13th  Page： 265-270  Publication year： 2000 
JST Material Number： W1183A  ISSN： 1084-6999  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
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*microswitch

About microswitch

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
静電駆動

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JST classification (1)：
JST classification
Category name(code) classified by JST.
Relays and switches 
(NA05060K)

About Relays and switches

Terms in the title (2)：
Terms in the title
Keywords automatically extracted from the title.
フリップチップ

About フリップチップ

, 
組立

About 組立


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