Art
J-GLOBAL ID：200902156491152844   Reference number：98A0287278

Development of Surface Activated Bonding Equipment for Wafers.

ウエハ対応表面活性化接合装置の開発
Author (3)：
SASAKI YASUHIKO

About SASAKI YASUHIKO

(日立 機械研)

About 日立 機械研

, 
KANAMARU MASATOSHI

About KANAMARU MASATOSHI

(日立 機械研)

About 日立 機械研

, 
KAWANO AKIOMI

About KAWANO AKIOMI

(日立 機械研)

About 日立 機械研


Material：
Symposium on Microjoining and Assembly Technology in Electronics  (Proceedings of the Symposium on Microjoining and Assembly Technology in Electronics)

About Symposium on Microjoining and Assembly Technology in Electronics


Volume： 4th  Page： 167-172  Publication year： Jan. 1998 
JST Material Number： L2496A  Document type： Proceedings
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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*wafer

About wafer

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Manufacturing technology of solid-state devices 
(NC03030V)

About Manufacturing technology of solid-state devices

,  Welding techniques 
(WC07030G)

About Welding techniques

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
ウエハ

About ウエハ

, 
表面活性化接合

About 表面活性化接合

, 
開発

About 開発


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