A flip chip bonding technology using gold pillars for millimeter-wave applications.

AOKI S; SOMETA H; YOKOKAWA S; ONO K; HIROSE T; OHASHI Y

Art

J-GLOBAL ID：200902162323151948 Reference number：98A0047518

A flip chip bonding technology using gold pillars for millimeter-wave applications.

金ピラーを用いたミリ波用フリップチップボンディング技術

Publisher site Copy service {{ this.onShowCLink("http://jdream3.com/copy/?sid=JGLOBAL&noSystem=1&documentNoArray=98A0047518&COPY=1") }}
Access JDreamⅢ for advanced search and analysis. {{ this.onShowJLink("http://jdream3.com/lp/jglobal/index.html?docNo=98A0047518&from=J-GLOBAL&jstjournalNo=A0636A") }}

Author (6)： , , , , ,
Material：
Volume： 1997 Issue： Vol.2 Page： 731-734 Publication year： 1997
JST Material Number： A0636A ISSN： 0149-645X Document type： Proceedings
Article type：原著論文 Country of issue： United States (USA) Language： ENGLISH (EN)

,...

To see more with JDream III (charged). {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=98A0047518&from=J-GLOBAL&jstjournalNo=A0636A") }}

Manufacturing technology of solid-state devices

, , ,

Return to Previous Page