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J-GLOBAL ID：200902164820152241   Reference number：93A0958523

Special issue : Inspecting semiconductor related materials thoroughly.Semiconductor encapsulants.

特集/半導体関連材料を総点検する 半導体封止材料
Author (1)：
SAWAI KAZUHIRO

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(東芝ケミカル)

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Material：
電子材料  (Electronic Parts and Materials)

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Volume： 32  Issue： 11  Page： 71-76  Publication year： Nov. 1993 
JST Material Number： F0040A  ISSN： 0387-0774  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
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airtight material

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Materials of solid-state devices 
(NC03020K)

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点検

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半導体封止材料

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