Art
J-GLOBAL ID：200902164856090900   Reference number：99A0205244

Numerical Stress Analysis of Resin Cracking in LSI Plastic Packages under Temperature Cyclic Loading. Part III. Material Properties and Package Geometries.

温度サイクル負荷におけるLSIプラスチックパッケージの樹脂亀裂の数値応力解析(III) 材料物性とパッケージ構造
Author (3)：
SAITOH T

About SAITOH T

(NEC Corp., Kanagawa, JPN)

About NEC Corp., Kanagawa, JPN

, 
MATSUYAMA H

About MATSUYAMA H

(NEC Corp., Kanagawa, JPN)

About NEC Corp., Kanagawa, JPN

, 
TOYA M

About TOYA M

(Kagoshima Univ., Kagoshima, JPN)

About Kagoshima Univ., Kagoshima, JPN


Material：
IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B: Advanced Packaging  (IEEE Trans Compon Packag Manuf Technol Part B)

About IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B: Advanced Packaging


Volume： 21  Issue： 4  Page： 407-412  Publication year： Nov. 1998 
JST Material Number： W0590A  ISSN： 1070-9894  Document type： Article
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
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*IC package

About IC package

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
*fatigue crack

About fatigue crack

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Materials of solid-state devices 
(NC03020K)

About Materials of solid-state devices

,  Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

Terms in the title (8)：
Terms in the title
Keywords automatically extracted from the title.
温度サイクル

About 温度サイクル

, 
LSI

About LSI

, 
プラスチックパッケージ

About プラスチックパッケージ

, 
亀裂

About 亀裂

, 
数値

About 数値

, 
応力解析

About 応力解析

, 
材料物性

About 材料物性

, 
パッケージ構造

About パッケージ構造


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