Art
J-GLOBAL ID：200902165737856365   Reference number：02A0566909

Reliability Issues of Pb-free Solder Joints in Electronic Packaging Technology.

電子部品実装技術における鉛フリーはんだ接合部の信頼性問題
Author (2)：
TU K N

About TU K N

(UCLA, CA)

About UCLA, CA

, 
ZENG K

About ZENG K

(UCLA, CA)

About UCLA, CA


Material：
Proceedings. Electronic Components & Technology Conference  (IEEE Electronic Components and Technology Conference)

About Proceedings. Electronic Components & Technology Conference


Volume： 52nd  Page： 1194-1200  Publication year： 2002 
JST Material Number： H0393A  ISSN： 0569-5503  Document type： Proceedings
Article type： 解説  Country of issue： United States (USA)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
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All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
*soldering

About soldering

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
鉛フリーはんだ

About 鉛フリーはんだ

,...
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JST classification (3)：
JST classification
Category name(code) classified by JST.
Connecting parts 
(NA05050Z)

About Connecting parts

,  Measurement,testing and reliability of solid-state devices 
(NC03040G)

About Measurement,testing and reliability of solid-state devices

,  Environmental problems 
(SA01020V)

About Environmental problems

Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
電子部品実装

About 電子部品実装

, 
鉛フリーはんだ

About 鉛フリーはんだ

, 
接合部

About 接合部


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