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J-GLOBAL ID：200902170970149664   Reference number：00A0795493

高品質を目指すはんだ付け技術 情報機器におけるSMTはんだ付け品質の管理

Author (1)：
KYO SHINTAKU

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(LGIC)

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Material：
エレクトロニクス実装技術  (Electronic Packaging Technology)

About エレクトロニクス実装技術


Volume： 16  Issue： 9  Page： 52-55  Publication year： Sep. 2000 
JST Material Number： L0322A  ISSN： 1342-2839  Document type： Article
Article type： 解説  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
Thesaurus term：
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All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
*soldering

About soldering

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
SMT【実装】

About SMT【実装】


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JST classification (1)：
JST classification
Category name(code) classified by JST.
Connecting parts 
(NA05050Z)

About Connecting parts

Terms in the title (4)：
Terms in the title
Keywords automatically extracted from the title.
高品質

About 高品質

, 
はんだ付け

About はんだ付け

, 
情報機器

About 情報機器

, 
SMT

About SMT


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