Art
J-GLOBAL ID：200902171124340544   Reference number：99A0114699

Effects of current density on adhesion of copper electrodeposits to polyimide substrates.

ポリイミド基体への電着銅の付着力への電流密度の影響
Author (2)：
PRENTICE G A

About PRENTICE G A

(Univ. Detroit Mercy, MI, USA)

About Univ. Detroit Mercy, MI, USA

, 
CHEN K S

About CHEN K S

(Sandia National Lab., NM, USA)

About Sandia National Lab., NM, USA


Material：
Journal of Applied Electrochemistry  (J Appl Electrochem)

About Journal of Applied Electrochemistry


Volume： 28  Issue： 9  Page： 971-977  Publication year： Sep. 1998 
JST Material Number： B0393B  ISSN： 0021-891X  Document type： Article
Article type： 原著論文  Country of issue： Netherlands (NLD)  Language： ENGLISH (EN)
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
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*Electroplating

About Electroplating

,...
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JST classification (2)：
JST classification
Category name(code) classified by JST.
Electroplating 
(WC08023B)

About Electroplating

,  Surface treatment 
(YH04112X)

About Surface treatment

Terms in the title (5)：
Terms in the title
Keywords automatically extracted from the title.
ポリイミド

About ポリイミド

, 
電着

About 電着

, 
銅

About 銅

, 
付着力

About 付着力

, 
電流密度

About 電流密度


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